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NP80N04EHE, NP80N04KHE, NP80N04CHE, NP80N04DHE, NP80N04MHE, NP80N04NHE
TAPE INFORMATION
There are two types (-E1, -E2) of taping depending on the direction of the device.
Draw-out side
MARKING INFORMATION
NEC
80N04
HE
Reel side
Pb-free plating marking
Abbreviation of part number
Lot code
RECOMMENDED SOLDERING CONDITIONS
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
sales representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Soldering Method
Infrared reflow
MP-25ZJ, MP-25ZK
Wave soldering
MP-25, MP-25K, MP-25SK,
MP-25 Fin Cut
Partial heating
MP-25ZJ, MP-25ZK,
MP-25K, MP-25SK
Partial heating
MP-25, MP-25 Fin Cut
Soldering Conditions
Maximum temperature (Package's surface temperature): 260 ° C or below
Time at maximum temperature: 10 seconds or less
Time of temperature higher than 220 ° C: 60 seconds or less
Preheating time at 160 to 180 ° C: 60 to 120 seconds
Maximum number of reflow processes: 3 times
Maximum chlorine content of rosin flux (percentage mass): 0.2% or less
Maximum temperature (Solder temperature): 260 ° C or below
Time: 10 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Maximum temperature (Pin temperature): 350 ° C or below
Time (per side of the device): 3 seconds or less
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Maximum temperature (Pin temperature): 300 ° C or below
Time (per side of the device): 3 seconds or less
Recommended
Condition Symbol
IR60-00-3
THDWS
P350
P300
Maximum chlorine content of rosin flux: 0.2% (wt.) or less
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet D14239EJ7V0DS
9
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